CISA description
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
Qualcomm · Multiple Chipsets
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Vulnerability data triggers these controls during assessment and continuous monitoring.