CVE-2023-33063

CISA description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Required action

Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

Notes & references

• This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110
• https://nvd.nist.gov/vuln/detail/CVE-2023-33063

Where this lands in 800-53

Vulnerability data triggers these controls during assessment and continuous monitoring.

• RA-5 · Vulnerability Monitoring and Scanning
• SI-2 · Flaw Remediation
• CM-6 · Configuration Settings
• SI-7 · Software, Firmware, and Information Integrity
• CM-8 · System Component Inventory

External lookups

• NVD · CVE-2023-33063
• CVE.org · CVE-2023-33063
• CISA KEV catalog (canonical)